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SPECIFICATION
ITEM MODEL Revision No. CHIP LED DEVICE SSC-YE101-IG0
[Contents]
1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-YE101-IG0 Seoul Semiconductor
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1. Features
Package : 1.6x0.8x0.8mm Untinted, Diffused flat mold Wavelength : 587
2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM*1 VR Topr Tstg Value 69 30 50 5 -30 ~ 85 -40 ~ 100
(Ta=25) Unit V
*1 IFM conditions: Pulse width Tw 0.1ms, Duty ratio 1/10
3. Electro-Optical Characteristics Parameter Forward Voltage Reverse Current Luminous Intensity*2 Wavelength Spectral Bandwidth Viewing angle*3 Symbol VF IR IV
D
(Ta=25) Condition IF=20 VR=5V IF=20 IF=20 IF=20 IF=20 Min 1.8 45 583 Typ 2.1 80 587 20 120 Max 2.3 10 120 593 Unit V mcd
2
1/2
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. .
(Tolerance : Iv 10 %, D 2 nm, VF 0.1 V) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-QP-0401-06(REV.1)
SSC-YE101-IG0
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4. Characteristic Diagram
Forward Current vs Forward Voltage
100
200 180 160
Relative Intensity vs Forward Current
Forward current IF (mA)
10
Relative Intensity IV (%)
140 120 100 80 60 40 20
1
0.1 1.6 1.8 2.0 2.2 2.4
0 -5 0 5 10 15 20 25 30 35 40 45
Forward Votage VF(V)
Forward Current IF (mA)
Forward Current Derating Curve
40
Radiation Diagram
30
Forward current IF(mA)
20
10
0 -25
0
25
50
75
100
Ambient temperature Ta()
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-YE101-IG0
- 3/7 -
5. Soldering Profile Reflow Soldering Conditions/ Profile
(1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface temperature
LED Surface temperature
C Operation heating 240
150
~
Pre-heating
Temperature rise: 5C/sec.
Cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead-Free Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 260max. for 10 seconds max.
C Operation heating 260
150 ~ 120 0
Pre-heating
Temperature rise: 5C/sec.
Cooling: -5C/sec.
60 to 120 sec.
10 sec.
(3) Hand Soldering conditions -Not more than 3 seconds @MAX280, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don't guarantee the products.
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-YE101-IG0
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6. Outline Dimension
Tolerance: 0.1,
Polarity Mark
Unit:
Cathode
PCB
Anode
7. Packing
[Recommended Solder Pattern]
Tolerance: 0.2,
Unit:
(1) Quantity: 4,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be 0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SSC-YE101-IG0
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
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8. Reel Packing Structure
Reel
PART N O.: # # # # # # # # # # PO NUMBER : ########
Q U A N TIT Y : 4,0 0 0 LOT NUMBER: ########## SSC PART NU M BER : SSC # #101
Aluminum Vinyl Bag
PART N O.: # # # # # # # # # # PO NUMBER : ######## Q U A N TIT Y : 4,0 0 0 LOT NUMBER: ########## SSC PART NU M BER : SSC # #101
Outer Box
*Material: Paper(SW3B(B)) a 7inch 245 c
CHIP LED
PART : SSC##101 CODE : Q'YT : 40,000EA
TYPE
SIZE(mm) b 220 c 142
CHIP LED b a
LOT NO : DATE :
SEOUL SEMICONDUCTOR CO.,LTD
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-YE101-IG0
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9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5 ~30 Humidity : 60%HR max. (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40 Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 605. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDs must be soldered within seven days after opening the moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice.
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-YE101-IG0
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